OUR SERVICES
Advanced PCB
An advanced PCB is a multilayer printed circuit board with more layers than a standard one.
It is common to use advanced circuit boards in high-precision electronic devices. As technology continues to develop, demand is also on the rise. In order to achieve the best possible time to market and competitive advantage, we have opened a separate advanced PCB production workshop. Our fabrication capabilities, punctuality, and product quality allow us to produce PCBs in the most sustainable way and at the lowest total cost.
Advanced PCB Application
Communications, industrial control, computer applications, medical, test equipment, and other fields often use advanced PCBs. It is competitive on the basis of leading technology, high quality, high precision rate, rapid delivery, consultative customer service, and optimal cost efficiency with ISO9001, ISO14001, TS16949, UL, RoHS certifications.
Automotive
A circuit board that is extremely reliable with an emphasis on safety is essential for the automobile industry. Electrified vehicles, hybrid vehicles, automotive electronics, powertrains, and safety for vehicles.
Telcom
The telecom industry requires a very wide range of PCBs, driving devices in stable office environments to extreme outdoor weather and temperature conditions. Communications equipment, 5G/4G, wireless, digital TV, mobile phone, fiber optic, radio frequency, Bluetooth.
Medical
It is essential for the medical field to have high levels of technology with extreme reliability and long life cycles. Medical equipment, wearables, telemedicine, wearable 3D printing, internet +, and mobile medical.
Electronics
High performance technology in the consumer electronics industry must be both complex and compact at the same time. Robotics, automation, motors, industrial instrumentation, sensors, etc.
Need Advanced PCB?
Empower your projects with precision and performance – discover our advanced PCB solutions. Unleash innovation, reliability, and cutting-edge technology in every design. Elevate your electronics with PCBs engineered for excellence. Experience the future of circuitry – choose advanced PCBs for unparalleled quality and functionality.
Advanced PCB Capabilities
Below is some information on the key capabilities Elipcb offers and supports today. In this section, you will find information about the specific materials and PCB technologies we can support, as well as the types of products that we currently produce and some of the tolerances that we can achieve.
| Categories | Item | Standard Capability | Best Capability |
| Basic info | Layer count(max) | 26 | 48 |
| Min finished board thickness(mm) | 0.1 | 0.05 | |
| Max finished board thickness(mm) | 6.3 | 8.0 | |
| Max Production Panel Size | 545*650 | 620*2300 | |
| Min core thickness(I/L)(mm) | 0.075 | 0.05 | |
| Min Core Dielectric Thickness(mm) | 0.075 | 0.05 | |
| Stackup | Through-hole PCB | yes | yes |
| Mechanical-Blind/buried via PCB | yes | yes | |
| Metal base PCB | yes | yes | |
| HDI Plus 1 | yes | yes | |
| HDI Plus 2(Staggered μvia or Stepped μvia) | yes | yes | |
| HDI Plus 3(Staggered μvia or Stepped μvia) | yes | yes | |
| Anylayer | yes | yes | |
| Hole | Min.Drilled Hole Size-Mechanical(mm) | 0.15 | 0.1 |
| Min.Drilled Hole Size-Laser | 0.075 | 0.05 | |
| Max.Drilled Hole Size-Mechanical(mm) | 6.5 | 6.5 | |
| Min.PTH Slot hole size(mm) | 0.4 | 0.35 | |
| Min.NPTH Slot hole size(mm) | 0.4 | 0.4 | |
| Drilling hole to hole accuracy(mm) | ±0.075 | ±0.05 | |
| PTH Tolerance(mm) | ±0.075 | ±0.05 | |
| NPTH Tolerance(mm) | ±0.05 | ±0.025 | |
| Controlled Depth Drilling Tolerance | ±0.075 | ±0.025 | |
| Max.Mechanical Drill Aspect Ratio | 10：1 | 16：1 | |
| Max.Laser Drill Aspect Ratio | 0.8：1 | 1.2：1 | |
| PTH To Copper | 0.15 | 0.12 | |
| Trace、Soldermask、Slikscreen | Min.Inner Layer Trace | 0.075 | 0.05 |
| Min.Inner Layer Space | 0.075 | 0.05 | |
| Min.Outer Layer Trace | 0.075 | 0.05 | |
| Min.Outer Layer Space | 0.075 | 0.05 | |
| Trace width Tolerance | ±15% | ±8% | |
| Max.Inner Layer Copper Thickness | 6oz | 12oz | |
| Max.Outer Layer Copper Thickness | 6oz | 14oz | |
| Impedance control Tolerance | 10% | 5% | |
| Layer To Layer Registration Tolerance＜10L | 0.1 | 0.075 | |
| Layer To Layer Registration Tolerance≥10L | 0.1 | 0.075 | |
| Via In PAD | 0.175 | 0.15 | |
| Min IC Pad size | 0.2 | 0.15 | |
| Min BGA pad size | 0.2 | 0.18 | |
| Soldermask Registration | 0.05 | 0.025 | |
| Min.Solder Dam | 0.075 | 0.045 | |
| S/M Registration | 0.05 | 0.025 | |
| Min. Legend Height/width | 0.8/0.15 | 0.60mm/0.10mm | |
| Mechanical | Routing outline Tolerance | ±0.05 | ±0.05 |
| punch outline Tolerance | ±0.1 | ±0.075 | |
| V-cut location Tolerance | ±0.075 | ±0.05 | |
| V-cut Residual Tolerance | ±0.075 | ±0.05 | |
| GF Charmfer Angel | 15-45 | 15-45 | |
| GF Charmfer Angel Tolerance | ±5° | ±3° | |
| GF Charmfer Depth(mm) | ≥0.1 | ≥0.1 | |
| GF Charmfer Depth Tolerance | ±0.075 | ±0.05 | |
| Other | Microsect Report | Yes | Yes |
| Solderability Testing | Yes | Yes | |
| COC Report | Yes | Yes | |
| Ionic contamination testing | Yes | Yes | |
| nickel and gold thickness | Yes | Yes | |
| Impedance Test Report | Yes | Yes | |
| High low temperature cycle test | Yes | Yes | |
| Bow and twist | Yes | Yes | |
| Surface Finishing | ENIG | Yes | Yes |
| OSP | Yes | Yes | |
| ENIG + OSP | Yes | Yes | |
| ENIG + GF | Yes | Yes | |
| Electrolytic Tin | Yes | Yes | |
| Electrolyitc Silver | Yes | Yes | |
| Electrolyitc Platinum Gold | Yes | Yes | |
| EING | Yes | Yes | |
| Immersion Tin | Yes | Yes | |
| Immersion Silver | Yes | Yes | |
| Lead HASL | Yes | Yes | |
| Lead-free HASL | Yes | Yes | |
| Electrolytic Gold | Yes | Yes | |
| Electrolytic Gold | Yes | Yes | |
| Material | Normal Tg, Middle Tg, High Tg | Yes | Yes |
| Lead Free, Halogen Free | Yes | Yes | |
| Low Dk laminate | Yes | Yes | |
| Low Loss laminate | Yes | Yes | |
| High Frequency laminate | Yes | Yes | |
| High speed material | Yes | Yes | |
| Metal Lamination | Yes | Yes | |
| RCC Lamination | Yes | Yes | |
| PTC Lamination | Yes | Yes | |
| Metallic Carbon Lamination | Yes | Yes | |
| Ceramics Lamination | Yes | Yes | |
| PI laminate | No | No | |
| BT laminate | No | No | |
| PTFE Lamination | Yes | Yes | |
| Advanced | Buried Capacitor | yes | yes |
| Buried Resistor | yes | yes | |
| Embedded coin | yes | yes | |
| Rigid-Flex | yes | yes | |
| Rigid-Flex + HDI | yes | yes | |
| Substrate | No | No | |
| High multi-layer heavy copper | yes | yes | |
| 5G Communication | yes | yes | |
| Photoelectric module | yes | yes | |
| Rigid-Flex + Metal Base | yes | yes | |
| Special Technology | Board edge Plated | yes | yes |
| Half Hole | yes | yes | |
| Long-short Golden Finger | yes | yes | |
| Carving process | yes | yes | |
| Hubird Lamination | yes | yes | |
| Sidestep hole | yes | yes | |
| Via in Pad | yes | yes | |
| Back Drill | yes | yes | |
| Countersunk Hole | yes | yes | |
| Lead Time | 2 layer | 4 | 2 |
| 4 layer | 5 | 3 | |
| 6 layer | 6 | 4 | |
| 8 layer | 6 | 4 | |
| 10 layer | 8 | 7 | |