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Rigid PCB
In the PCB world, rigid PCB is the most traditional type that is still very popular today and found in many products we use on a daily basis.
Rigid PCB is a form of of regular PCB which are solid and inflexible in their structure and therefore cannot be bent or flexed because it comes with FR4 stiffener which is very useful for added amount of stiffness and rigidity.
Several layers are bonded together with adhesive and heat, such as a substrate layer, a copper layer, a solder mask layer, and a silk screen layer.
Definition & Core Characteristics
A rigid PCB is the most common fundamental component in the electronics industry. It provides mechanical support for electronic components and enables electrical connections through its conductive circuitry. Its most defining characteristic is that its shape is fixed after manufacturing, offering good mechanical strength and stable electrical performance. The typical thickness is usually 1.6mm, but it can vary according to specific requirements.
Common Types
Based on the number of circuit layers, rigid PCBs are mainly divided into the following three types:
Single-sided PCB: Has conductive traces on only one side; the other side has none. It features a simple structure and low cost, suitable for relatively simple electronic products like early radios and calculators.
Double-sided PCB: Has conductive traces on both sides, with the two sides connected by Plated Through Holes (PTH). This design significantly improves wiring density and is widely used in household appliances, power supplies, and other equipment.
Multilayer PCB: Formed by alternately pressing together three or more conductive layers and insulating layers. It features higher component density and more complex electrical performance, commonly used in computer motherboards, graphics cards, AI servers, communication equipment, etc.
Beyond these basic categories, technological development has also led to High-Density Interconnect (HDI) boards. HDI uses finer interconnect structures like blind vias and buried vias to achieve higher wiring density within a smaller area. This makes it particularly suitable for space-constrained, high-performance applications such as smartphones and AI accelerator cards.
Main Materials
The substrate of a rigid PCB is typically a composite of resin, reinforcing material (e.g., fiberglass), and copper foil.
Most Common Material – FR-4: This is a glass-reinforced epoxy resin copper-clad laminate. It offers excellent mechanical strength, electrical insulation, and flame retardancy, making it the most universal choice for rigid PCBs.
High-Performance Materials: In the aerospace field, Polytetrafluoroethylene (PTFE) is used to meet requirements for high-temperature resistance, corrosion resistance, and high-frequency signal transmission. For high-power design scenarios, enhanced thermal dissipation PCBs, incorporating embedded copper coins or thick copper, are also used.
Key Manufacturing Process Flow
The manufacturing of a rigid PCB is a high-precision physical and chemical process. The main steps are as follows:
Inner Layer Circuit Creation: Fine inner circuits are formed on copper-clad laminates through processes like lamination, exposure, development, and etching.
Lamination: The processed inner layer board is pressed together with prepreg and outer layer copper foil under high temperature and high pressure to form a complete multilayer board structure.
Drilling & Plating: CNC drilling machines are used to drill holes for component insertion and interlayer connection. Then, through electroless copper deposition and electroplating processes, the hole walls are metallized to achieve interlayer conductivity.
Outer Layer Circuit Creation: Pattern transfer and etching are performed again on the outer copper foil to form the final outer layer circuits.
Solder Mask & Surface Finish: A layer of solder mask ink (typically green) is applied to protect the circuits and prevent solder shorts. Then, an appropriate surface finish process is selected based on product requirements – such as Hot Air Solder Leveling (HASL), Electroless Nickel Immersion Gold (ENIG), Organic Solderability Preservative (OSP), etc. – to protect the exposed copper and ensure good solderability.
Testing & Inspection: Finally, Automated Optical Inspection (AOI) and electrical performance testing are performed to ensure that the circuit continuity and performance of each PCB comply with the design specifications.
Main Application Areas
Leveraging its robust durability and stable performance, rigid PCBs are used in almost all electronic devices:
AI & Computing: GPUs, AI accelerator cards, servers, data center switches.
Communications: 5G base stations, networking equipment.
Consumer Electronics: Computer motherboards, household appliances, smartphone motherboards.
Industrial & Automotive: Industrial control systems, automotive Battery Management Systems (BMS), autonomous driving systems.
Others: Medical equipment, aerospace instrumentation, etc.
Rigid PCB Composition
At ELIPCB, we understand that the foundation of every electronic device lies in the composition of its Printed Circuit Board (PCB). Our Rigid PCBs are engineered with precision and care to meet the demands of modern electronics. Let’s delve into the key components that make up our high-quality Rigid PCBs:
1. Substrate Material:
Our Rigid PCBs are built on robust substrate materials, typically fiberglass-reinforced epoxy, known for its exceptional strength and dimensional stability. The substrate provides the base support for the entire PCB structure.
2. Copper Layers:
Copper is the heart of any PCB, facilitating efficient conduction of electrical signals. ELIPCB Rigid PCBs feature strategically placed copper layers, meticulously designed to optimize signal integrity and minimize signal loss.
3. Solder Mask:
To protect the copper traces from environmental factors and prevent unintended soldering, our Rigid PCBs are coated with a high-quality solder mask. This layer also enhances the visual contrast of the PCB, aiding in easy inspection.
4. Silkscreen:
ELIPCB integrates a silkscreen layer onto our Rigid PCBs, providing essential information such as component placement, polarity indicators, and reference designators. This aids in the assembly and maintenance processes.
5. Surface Finish:
The surface finish is a critical element for ensuring reliable solder joints and long-term durability. ELIPCB employs advanced surface finish technologies like HASL (Hot Air Solder Leveling), ENIG (Electroless Nickel Immersion Gold), or OSP (Organic Solderability Preservative) to meet diverse application requirements.
6. Vias and Holes:
Our Rigid PCBs are equipped with precision-drilled vias and holes, enabling the interconnection of different layers. These vias are meticulously placed to ensure efficient signal transmission and reliable conductivity.
7. Quality Assurance:
ELIPCB is committed to delivering Rigid PCBs of the highest quality. Each board undergoes rigorous testing and inspection processes to guarantee compliance with industry standards and customer specifications.
Need Rigid PCB Service?
Choose ELIPCB for Rigid PCBs that combine cutting-edge technology with reliability. Our commitment to excellence ensures that your electronic applications perform at their best. Contact us today to discuss your Rigid PCB requirements and discover how ELIPCB can elevate your electronic designs.
Rigid PCB Application
A rigid PCB is used in many products that we use every day for work and communication, including:
- GPS equipment: computers, laptops, tablets and mobile phones
- Medical equipment: X-rays, Heart monitors, CAT scans, MRI systems
- Aerospace industry: Aeroplane cockpit instrumentation, Temperature sensors, Control tower instrumentation
- Sometimes, rigid and flexible PCBs or flex-rigid boards are used in devices at the same time.