SMT Tooling

At ELIPCB, we understand that the right tools are essential for achieving impeccable results in Surface Mount Technology (SMT) assembly. Our state-of-the-art SMT tooling ensures accurate placement and securement of components, paving the way for high-quality printed circuit boards (PCBs).

Our Comprehensive Range of SMT Tooling Includes:

1. Pick and Place Machines:

   • Our advanced pick and place machines employ precision robotics to efficiently pick up electronic components and accurately place them onto designated positions on the PCB.

2. Solder Paste Stencils:

   • We utilize high-quality metal stencils with precision-cut apertures to facilitate the uniform application of solder paste onto the PCB, ensuring reliable electrical connections.

3. Component Feeders:

   • Our range of feeders includes tape feeders, tray feeders, and vibratory feeders, all designed to securely hold and dispense electronic components to the pick and place machine with precision.

4. Stencil Printers:

   • Our stencil printers are equipped to precisely apply solder paste onto the PCB through the openings in the stencil, ensuring consistent and accurate component placement.

5. Reflow Ovens:

   • Our reflow ovens provide controlled heating to melt the solder paste, creating strong and reliable solder joints between the components and the PCB.

6. Solder Paste Inspection (SPI) Machines:

   • Our SPI machines meticulously inspect and verify the quality of solder paste application, ensuring optimal soldering results.

7. Component Placement Verification Systems:

   • Equipped with advanced vision systems, these tools verify that components are accurately placed on the PCB, providing an additional layer of quality assurance.

8. Board Fixtures and Carriers:

   • Our fixtures and carriers securely hold the PCB in position during assembly, ensuring stability for precise component placement.

9. Wave Solder Fixtures:

   • These fixtures are crucial for maintaining PCB position and stability during the wave soldering process, guaranteeing accurate and reliable solder connections.

10. Nozzle Sets:

    • Our comprehensive range of nozzles is designed to accommodate components of various sizes and shapes, optimizing the pick and place process.

11. Stencil Cleaning Equipment:

    • We employ specialized equipment to thoroughly clean stencils after solder paste application, ensuring consistent and accurate printing in subsequent runs.

12. Component Taping Machines:

    • Our taping machines create custom component tapes, streamlining the pick and place process for specific component types.

13. Automated Optical Inspection (AOI) Machines:

    • These sophisticated systems employ advanced vision technology to inspect PCBs for defects, misalignments, and other issues after component placement.